Termalna pasta Thermaltake TG-30 Thermal Compound

High Thermal Conductivity The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs. Easy to Apply Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs. Sustainability and Safety The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.